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Comming Soon- 2010 Hi Q Capacitor Catalog
17 Oct 2009
Passive Plus will be releasing a new Hi Q Capacitor Catalog first quarter 2010. Includes new performance curves, additional new case sizes and an expanded Non Magnetic component offering
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FREE Engineering Hi-Q Design Kits
28 Aug 2009
New Hi-Q Design Kits available in 2 popular case sizes .055 x .055" (0505) and .110 x.110" (1111)
Kits available are:
0505= .1-2pF, 1-10pF, 10-100pF
1111= 1-10pF, 10-100pF, 100-1000pF
Available in two dielectrics: 1)P90 or 2)NPO
Magnetic or Non Magnetic (only 1111 series) One Free Kit per customer ($75 value) Call or email for your free Design kit
read more
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New Events!
28 Aug 2009
Visit us at European Microwave Week Rome (eumweek.com)! Visit us at Stand A2 (lapconf.co.uk)!
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New Reps - Worldwide
28 Aug 2009
We are constantly expanding our list of reps around the globe - we have recently added France, Germany, India, Israel, Nordic Region, Italy, and Korea.
read more
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Passive Plus will be exhibiting at MTT Boston
28 Aug 2009
Please visit us at booth 423.
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Passive Plus Exhibiting!
28 Aug 2009
Passive Plus exhibited at the Wireless 2.0, Silicon South West International Conference, with Dayford and CCL.
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Non-Mag EIA Capacitors
28 Aug 2009
Now available in 0603 & 0805 with NPO Dielectrics / Copper Barrier Terminations.
read more
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PASSIVE PLUS can provide manufacture of single and double sided conventional and PTH Printed Circuit boards.

PASSIVE PLUS is experienced in the manufacture of all types of multilayer PCB’s including those using mixed dielectric and specialist materials.

This offers an opportunity for designers to incorporate the RF & Microwave features along with any digital or analogue circuitry on the same board.


This eliminates the requirement for two or more separate pcb’s and therefore offers both cost and space reduction to the product.

PASSIVE PLUS has refined it’s expertise over many years to develop manufacturing processes and techniques to enable us to produce and assemble all types of flexible and flexi-rigid circuit boards.

In addition to this manufacture we are able to bond pins, solder and assemble connectors, and produce RFI and EMC shielded products.  Our engineers welcome the opportunity to work with your design team from concept stages through to production.

PASSIVE PLUS has always been at the forefront of Metal backed Printed circuit boards, whether it is using pre-bonded materials direct from the manufacturer or via post bonded techniques, (processing a conventional, PTH or multilayer and bonding it to a fully machined heat sink.)

Clearly both of these techniques offer advantages based on application and PASSIVE PLUS would be pleased to offer assistance in selecting the most appropriate materials and manufacturing route.

PASSIVE PLUS is keen to work with our business partners and two typical collaborations have yielded the following products.

These are some examples where two or more companies can collaborate to achieve a successful development and production process, and PASSIVE PLUS would welcome the opportunity to work with you.