Board Technologies

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PASSIVE PLUS can provide manufacture of single and double sided conventional and PTH Printed Circuit boards.

PASSIVE PLUS is experienced in the manufacture of all types of multilayer PCB’s including those using mixed dielectric and specialist materials.

This offers an opportunity for designers to incorporate the RF & Microwave features along with any digital or analogue circuitry on the same board.

This eliminates the requirement for two or more separate pcb’s and therefore offers both cost and space reduction to the product.

PASSIVE PLUS has refined it’s expertise over many years to develop manufacturing processes and techniques to enable us to produce and assemble all types of flexible and flexi-rigid circuit boards.

In addition to this manufacture we are able to bond pins, solder and assemble connectors, and produce RFI and EMC shielded products.  Our engineers welcome the opportunity to work with your design team from concept stages through to production.

PASSIVE PLUS has always been at the forefront of Metal backed Printed circuit boards, whether it is using pre-bonded materials direct from the manufacturer or via post bonded techniques, (processing a conventional, PTH or multilayer and bonding it to a fully machined heat sink.)

Clearly both of these techniques offer advantages based on application and PASSIVE PLUS would be pleased to offer assistance in selecting the most appropriate materials and manufacturing route.

PASSIVE PLUS is keen to work with our business partners and two typical collaborations have yielded the following products.

These are some examples where two or more companies can collaborate to achieve a successful development and production process, and PASSIVE PLUS would welcome the opportunity to work with you.

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